磷化铜
- 网络Copper phosphide;phosphor bronze;Cu P
![磷化铜](../cache/1407808.jpg)
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在装饰性和PCB电镀中,酸性光亮镀铜的阳极最佳含磷量为0.035%~0-070%,磷化铜(Cu3P)黑膜的生成对于阳极性能具有决定性的意义。
Optimum phosphorus content of copper-phosphorus anode in sulfate copper plating solution is 0 035 % ~ 0 070 % in the application of decorative and PCB electroplating . Formation of Cu 3P black film is significant fator to Cu-P anodic performance .
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磷化铜,含磷重量超过15%者
Copper phosphide containing more than 15 % by weight of phosphorus
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迄今为止,已发展了许多方法用来合成磷化镍、铜并探究它们的性质。
To date , many methods have been developed for the synthesis of phosphides of nickel and copper mirco / nanostructures , and simultaneously their properties were explored .
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分别采用表面包银和磷化处理的方法,提高了铜粉的抗氧化性能,使50nm铜超微粉末能稳定地存在于空气中,磷化处理后铜粉末的氧化温度高于220℃。
The oxidation resistance of ultramicro copper powder was much improved and the powder were stabilized in the air by using silver-coating method and phosphating treatment , respectively . Their oxidizing temperatures are beyond 220 ℃ .