磷化铜

在装饰性和PCB电镀中，酸性光亮镀铜的阳极最佳含磷量为0.035%～0－070%，磷化铜（Cu3P）黑膜的生成对于阳极性能具有决定性的意义。

Optimum phosphorus content of copper-phosphorus anode in sulfate copper plating solution is 0 035 % ~ 0 070 % in the application of decorative and PCB electroplating . Formation of Cu 3P black film is significant fator to Cu-P anodic performance .

磷化铜，含磷重量超过15%者

Copper phosphide containing more than 15 % by weight of phosphorus

迄今为止，已发展了许多方法用来合成磷化镍、铜并探究它们的性质。

To date , many methods have been developed for the synthesis of phosphides of nickel and copper mirco / nanostructures , and simultaneously their properties were explored .

分别采用表面包银和磷化处理的方法，提高了铜粉的抗氧化性能，使50nm铜超微粉末能稳定地存在于空气中，磷化处理后铜粉末的氧化温度高于220℃。

The oxidation resistance of ultramicro copper powder was much improved and the powder were stabilized in the air by using silver-coating method and phosphating treatment , respectively . Their oxidizing temperatures are beyond 220 ℃ .