电子浆料

电子浆料制备技术中，导电相金属粉末的制备是关键。

To manufacture electronic paste , manufacturing of conductive metal powder is the key technology .

用于氮化铝陶瓷基片的电子浆料

Electronic Paste for Aluminium Nitride Ceramic Substrate

Ni电子浆料的流变学特性研究

An investigation on the rheological behavior of Ni-contained electronical slurry

电子浆料用Bi2O3-B2O3系无铅玻璃粉性能研究

Study on the properties of Bi_2O_3-B_2O_3 lead-free glass powder used in electronic pastes

国内厚膜电子浆料的发展与应用

Development and application of electronic thick film paste in China

镀银铜粉导电电子浆料的研究

Study on Silver Plating Copper Powder Electro-conductive Paint Electron Cooling

贱金属电子浆料导电机理研究

Conduction Mechanism of Electronic Thick Film Material of Base Metal

铜系电子浆料的制备及其稳定性研究

Preparation and Stability Study of Copper Based Electrical Conductive Paste

电子浆料用银钯复合粉末的研制

Studies on the Composite Powder of Silver and Palladium Used in Electronic Serum

玻璃基板用电子浆料

Electronic paste for soda lime glass substrates

改性丙烯酸树脂型高温电子浆料有机载体的制备

Preparation of modified acrylic resin organic carrier used for electron paste of high sintering temperature

报道了铝、铜、镍、锌等贱金属的电子浆料。

The electronic thick film material is made of aluminum , copper , nickel and zinc powers .

激光功率密度对功能电子浆料电性能影响规律与炉中烧结温度对其影响规律相似。

Laser power density has the similar effect on electrical properties as the temperature of furnace sintering .

下面的图片和表格将会展示片式电阻的制造过程中电子浆料的应用。

The following drawing and sheet will show the Electronic paste that we manufacture for the Chip resistor .

通过测量丝网印刷后膜层的表面粗糙度来表征厚膜电子浆料的流平性，研究了常用表面活性剂司班85及卵磷脂含量对浆料流平性的影响。

Effects of surfactant on the leveling of thick-film paste were investigated by measuring the surface roughness of screen-printing film .

综述了高温电子浆料用无铅低熔玻璃和水性载体的发展现状。

The research progress in the lead-free low melting points glasses and aqueous vehicles for preparation of electronic pastes was reviewed .

结果表明，在优化条件下所得微细铜粉性能完全符合电子浆料用铜粉的要求。

The experimental results show that the fine copper powder prepared under optimum condition meets well the requirement for production of conductive ink .

用于厚膜工艺的有机金浆微细铜粉是可替代贵金属生产电子浆料的重要原材料。

Thick-Film Organic Gold Conductive Ink Fine copper powder has potentiality to be used instead of precious metals powder for preparation of conductive ink .

电子浆料是集电子、化工、冶金三位一体的高技术产品。

Electronic paste belongs to the high and new technology products , which is widely applied in electronic , chemical engineering , biological engineering field .

通过选择与优化有机树脂、固化剂、溶剂、填料等，开发了片式电阻用的系列有机聚合物电子浆料。

The Organic Polymer Pastes ( OPP ) in chip resistance were researched with selecting and modifying organic resin , curing agent , solvent , and filler .

提出了调节有机载体在不同温度下挥发量的方法，可为电子浆料烧成温度制度提供参考。

The methods to modify the volatility amount of organic vehicle were proposed , and the volatility data are useful for the reference of the sintering temperature schedule of electronic paste .

由于其良好的抗氧化性、热稳定性及高电导性，核壳结构铜-银包覆粉在电子浆料、导电填料等众多领域具有广阔的应用前景。

The core-shell Cu-Ag coated powder has a wide application in electronic slurry , conductive filler and other fields because of its good oxidation resistance , thermal stability and high conductivity .

超细铜粉在以铜代银并在电子浆料、陶瓷材料和化工催化剂等材料的制备中具有较好的应用前景。

Superfine copper powders can be used as the electronically conductive adhesives , ceramic materials and catalyst , and have shown a good application prospect instead of silver with copper in industry .

由于优异的物理化学性能，它被广泛用于润滑油，电子浆料，催化、医药、生物过滤器以及其它领域。

Due to their outstanding physical and chemical property , the copper powder can be widely used in lubricating oil , electrically conductive paste , medicine , biological filter and other purposes .

银是一种重要的贵金属，银被广泛应用于抗菌材料、医药材料、装饰材料、电子浆料、催化剂等领域。

Silver is one of the important precious metals . It has been widely used as antibacterial material , medical material , optical material , ornamental material , catalytic material , electrical and electronical materials , etc.

因此降低成本、寻找性能优良的新型导电粉体、以贱金属代替贵金属制备电子浆料已成为发展的趋势，在此背景下提出了本课题的研究。

Therefore , reducing the cost , searching for new conductive powder with excellent properties and using less expensive metals in place of precious ones to manufacture electronic paste have become the major development trends for electronic paste .

介绍片式电阻器尺寸变化及使用不同电极材料引起的方阻、电阻温度系数的变化。还介绍了几种实用于片式电阻器的电子浆料。

Size trends of chip resistors , sheet resistance and TCR ( temperature coefficent of resistivity ) change caused by use of different electrode paste are described and several kinds of electronic paste used for the chip resistors are introduced .

新型电子元器件电极浆料组成与性能的研究

Research on the Composition and Properties of New Electronic Components Electrode Paste

电子元器件的发展及其对电子浆料的需求

Development of Electronic Components and Its Requirements to Electronic Pastes

本文评述了我国多层片式陶瓷电容器、PDP平板显示器、硅太阳能电池、电子封装等的发展现状以及对电子浆料的要求，同时还评述了贱金属浆料的发展趋势。

The development of the chip ceramic capacitor , PDP ( plasma displays ), silicon solar cell and electronic package was reviewed in the present paper , and the requirements to electronic pastes and the growing trend of base metals electronic pastes were introduced .