Research on the thermal stress and warpage of WLCSP device
晶圆尺寸级封装器件的热应力及翘曲变形
The part is available in a32-lead lead frame chip scale package ( LFCSP ), and a25-ball wafer level chip scale package ( WLCSP ) .
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
wlcsp