wafer-
Would you like to know who ate the wafer ?
你想知道谁吃了威化饼么？
-
Automatic Water Baking Machine : a wafer production equipment with electric power or LPG to generate the heat energy for automatic completion of mixture and baking process .
隧道式烤炉：是生产威化饼设备、下浆、烘烤、出饼片全自动完成，热能采用电或液化气。
-
Remove the wafers with a spoon and transfer them to a plate
用勺子抄起薄饼，把它们转盛到盘子里。
-
All organic and metallic residues on the wafers must be removed .
片子上所有的有机和金属残留物均必须清除
-
Research and Design of Measuring and Sorting Quartz Crystal Wafer System
石英晶片测量分选系统的研究与设计
-
Piezoelectric Wafer Model and its Application in Structural Health Monitoring
压电晶体传感器激励模型及其在结构健康监测中的应用
-
Study on the New Method of CD Calibrating for IC Wafer
IC晶片关键尺寸标定的新方法研究
-
A Silicon Wafer Direct Bonding Mechanism and Rapid Thermal Bonding Technology
硅片直接键合机理及快速热键合工艺
-
Developmental trend for processing technology of 300 mm wafer chip manufacturing
300mm晶圆芯片制造技术的发展趋势
-
Two main wafer slicing methods are used currently .
目前，晶片切割主要的方法有金刚石内圆切割和线切割。
-
Decomposition Based Ant Colony Optimization Algorithm Applied to Semiconductor Wafer Fabrication System
基于问题分解的蚁群算法在半导体晶圆制造调度中的应用
-
Protection of wafer resources moving towards river basin model
水资源保护走向流域模式
-
Chemical Effect Mechanism in Chemical Mechanical Polishing for Silicon Wafer
硅晶片化学机械抛光中的化学作用机理
-
Research on Swarm Intelligence Based Scheduling Model for Semiconductor Wafer Fab
半导体生产线群体智能调度模型研究
-
Design of vacuum clamp system used for Si wafer
硅片真空夹紧系统设计
-
Effects of The Silicon Wafer Direct Bonding Interface on Device Performances
硅片直接键合界面的存在对器件性能的影响
-
New Method of Quality Controlling of LED Epi - Wafers
发光二极管外延片质量控制的新方法
-
Development of Core Wafer Core Materials for Use as Dual Sound Track Magnetic Head
双声道磁头用芯片材料的研制
-
The Analysis and Research About Silicon Wafer ′ s Polishing Fog
硅片抛光雾的分析研究
-
Study on quality improvement of silicon wafers annealed at high temperature in hydrogen
高温氢气退火提高硅片质量的研究
-
Methods of optimization for throughput and cycle time in semiconductor wafer fabrication
半导体晶圆制造中产量与生产周期的优化方法
-
The Edge Effect of SAW Wafer in Probe On-line Testing
SAW器件晶片在线探测中的边缘效应
-
Shape Bifurcation of an Elastic Wafer Due to Surface Stress
表面应力引起的弹性薄膜形状分叉
-
Research on special controlling technology of ultra-precision polishing machine for IC wafer
IC硅片纳米级抛光机专家控制技术的研究
-
In this paper , the key technologies of silicon wafer grinding equipment are analyzed .
本文分析了硅片超精密磨削设备的关键技术；
-
Research and design of the quartz wafer thickness gauge
石英晶片厚度检测仪研究设计
-
Semiconductor chip testing is very important for wafer fabrication .
半导体芯片的检测是芯片生产企业生产过程中的重要环节，芯片在检测过程中，由于圆形硅片的结构特点而造成的漏测又是困扰芯片生产企业不可小视的实际问题。
-
Hundred times of cleaning and drying process is applied during wafers manufacturing .
在集成电路的生产制造过程中，晶圆的清洗和干燥工艺是使用最频繁、重复次数最多的工艺过程。
-
Research Advances in Wafer Bonding Technique of GaN Material
GaN材料键合技术研究进展
-
Study on the Deposition of Copper onto Silicon Wafer Surface in HF Solution
HF溶液中铜离子在硅片表面沉积的研究