solders

The New Development in Lead - free Solders

无铅焊料的新发展

Technological Capabilities of Electronic Solders and Their Influence Factors

电子焊料的工艺性能及影响因素

Fewer workers are needed to solder circuit boards

焊接电路板需要的工人更少了。

He cuts the pieces and solders them together .

他把那些断片切碎，然后把它们焊在一起。

The stainless tubing is less likely to kink than copper , but it is harder to solder without an acid treatment .

不锈钢管比铜管不易纠结，但不经酸性处理焊接较困难。

Technology Demands and Test Methods of Performance of Solder Paste

焊膏工艺性要求及性能检测方法

Research and development trend of lead-free solder alloy at home and abroad

无铅软钎料国内外的研究动态与发展趋势

The Development of Test Instrument for Solder Paste Print Performance

焊膏印刷性能测试仪器的研制

Development of a High Performance Lead-Free Wave Solder Alloy

开发高性能的无铅波峰焊料合金

The Technology and Quality Control of Solder Mask in PCB

印制板阻焊膜制作工艺及品质控制

Application of brass solder integrated air board on air line system of locomotive

钎焊集成气路板在机车空气管路系统上的应用

It is important to tailor cooling rate to improve solder joint quality .

选择合适的冷却速率可以提高焊点质量。

Effects of thermal cycle parameters and substrate dimensions on solder joint reliability

热循环参数及基板尺寸对焊点可靠性的影响

Study of the Effect of CuP 14 on Sn-Zn Solder Alloy System

CuP14合金对Sn-Zn系钎料合金的性能影响研究

Analysis of solder joint position , check multilayer welding .

分析焊点位置，检查多层板焊接。

Overview on Solder Joint Shape Prediction Technology in Electronic Packaging

电子封装软钎焊焊点形态预测技术研究现状

So study lead-free solder paste in the electronic application package is important .

因此研究无铅锡膏在电子封装中的应用具有重要意义。

Tin Based Alloy Solder Powder for Free Cleaning Type Soldering Paste

免清洗型软钎膏用锡基合金焊粉

Thermal stress analysis and fatigue life prediction for solder joint of SCSP

叠层芯片封装元件热应力分析及焊点寿命预测

Reliability Evaluation and Analysis Technology of Pb-free Solder Mounting Components

无铅焊料安装元件的可靠性评价和解析技术

High performance electronic lead free solder CWB & 07 series were developed .

研制了一种具有自主知识产权的高性能无铅电子钎料CWB&07系列。

Finite Element Analysis for Flip Chip Solder Joint Reliability

倒装芯片焊点可靠性的有限元模拟法探讨

Study On The Application of Solder Used in Gold-plated PCB

镀金层电子线路用特种焊料应用研究

Defect Analysis and Process Improvement of BGA Solder Joint

BGA焊点的缺陷分析与工艺改进

Optimization Design with CAE for Precision Injection Mould for Solder Wire Plates

精密焊丝盘注塑模具的CAE优化设计

Overview on Two Types of Ceramic Array Package and Their Solder Joint Reliability

陶瓷阵列封装的两种形式及其接头可靠性

Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints

球栅阵列倒装焊封装中的热应变值的测试

Now we can use temporary solder mask to solve all the problems .

现在，我们可以用临时阻焊膜来解决这一问题。

The Effects of PBGA Solder Evolving Parameters on Thermal Fatigue Life

PBGA焊点形态参数对热疲劳寿命的影响

Study of a New Type of Au-Ag-Si Intermediate Temperature Eutectic Solder

Au-Ag-Si新型中温共晶钎料的研究