soldering

The control performance of the control system affects the soldering quality of electronic products .

波峰焊机控制系统的性能直接影响到电子产品的焊接质量。

Discussion on How to Improve the Quality of Wave - peak Soldering

谈谈怎样提高波峰焊接质量

Fewer workers are needed to solder circuit boards

焊接电路板需要的工人更少了。

The stainless tubing is less likely to kink than copper , but it is harder to solder without an acid treatment .

不锈钢管比铜管不易纠结，但不经酸性处理焊接较困难。

Care must be exercised in attaching the lead wires to the soldering tabs .

在往接线片上焊导线时必须非常小心

I suggest posing me with a soldering wand over my head like a sword .

我想让自己这样像把剑一样把电焊杆举过头顶

Technology Demands and Test Methods of Performance of Solder Paste

焊膏工艺性要求及性能检测方法

Establishment and Analysis of Wave Soldering Solder Joints Finite Element Model

波峰焊焊点有限元模型的建立与分析

The Development of Test Instrument for Solder Paste Print Performance

焊膏印刷性能测试仪器的研制

The Research Progress on Soldering Materials for Electronics Industry

电子软钎焊材料的研究进展

The paper introduces the design of the control system of wave soldering machine and its controller .

本文介绍了波峰焊控制系统的总体设计和控制器的开发，并且在文中重点对基于继电反馈的PID控制参数自整定算法及纯滞后补偿控制算法进行了深入的研究。

It is important to tailor cooling rate to improve solder joint quality .

选择合适的冷却速率可以提高焊点质量。

Study of the Effect of CuP 14 on Sn-Zn Solder Alloy System

CuP14合金对Sn-Zn系钎料合金的性能影响研究

Electrical communication engineering ; soldering distributors , requirements and test conditions .

电讯技术。焊片端子板。要求和检验。

In addition , electricity resistance of the solder also has been measured .

除此之外，还对焊料进行了电阻测量。

Analysis of solder joint position , check multilayer welding .

分析焊点位置，检查多层板焊接。

Application of SPC in Quality Control of Solder Paste Printing

SPC在焊膏印刷质量控制中的应用

Influence of Strain Rate Effect on Behavior of Solder Joints under Drop Impact Loading

应变率效应对无铅焊锡接点跌落冲击力学行为的影响

Use plenty of soldering flux to ensure a perfect connection .

使用大量的焊接通量，以确保完美的连接。

Thermal fatigue Random variable Probabilistic analysis Solder joint Lognormal distribution ;

热疲劳；随机变量；概率分析；焊点；对数正态分布；

Soldering technology for Lead-free and problems in its application

无铅焊接技术及其在应用中存在的问题

Probe into the Soldering Methods for Cast Iron Part

铸铁零件焊补方法的探讨

High performance electronic lead free solder CWB & 07 series were developed .

研制了一种具有自主知识产权的高性能无铅电子钎料CWB&07系列。

Preparation and Study on Active Substance of Soldering Flux

助焊剂活性物质的制备与研究

Study On The Application of Solder Used in Gold-plated PCB

镀金层电子线路用特种焊料应用研究

Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints

球栅阵列倒装焊封装中的热应变值的测试

Now we can use temporary solder mask to solve all the problems .

现在，我们可以用临时阻焊膜来解决这一问题。

The applications and developments of nickel - base solder powder

镍基钎料粉末的应用与发展

Polymer Stencil for high Quality and Speed Solder Paste Printing

适合高质量高速度印刷高聚物模版

After soldering with Vacuum System , there void rate would be below 1 % .

用真空方法能够把焊接空洞率降到低于1%。