heatsink

Analysis on Testing Method and Experimental Results of GTO Assembly Heatsink

GTO组件用散热器的试验方法及实验结果分析

Mechanism Design of Feeding System for Rowing Welding Machine of Heatsink

散热器排焊机的物料进给系统机构设计

Study of Heatsink Electromagnetic Radiation Based on Vector FEM

基于矢量有限元法的热沉结构电磁辐射研究

Application of FDTD method to analysis of coupling capacitance between heatsink and devices

FDTD法研究散热片与器件间的耦合电容

Microchannel Heatsink of High Beam Quality Semiconductor Laser Array

高光束质量大功率半导体激光阵列的微通道热沉

Structural parameter of micro-channel heatsink is optimized through numerical calculation .

针对高功率二极管激光器（DL）的散热需求，对不同结构的微通道冷却器进行了模拟散热计算，优化了冷却器的结构参数。

Analysis of shielding effect on coupling capacitance between heatsink and power electronic device by FDTD method

用FDTD法分析散热片屏蔽层对耦合电容的时频特性影响

Microchannel heatsink for the heat dissipation of high power semiconductor laser diode arrays

用于高功率半导体激光器列阵散热的微通道热沉的研制

Secondly , the thermal conductivity of heatsink better .

其次，散热片的导热性要好。

The reserch on microchannel heatsink for high power semiconductor laser

高功率半导体激光器微通道热沉研究

Micro-channel heatsink module for high power diode laser

高功率二极管激光器模块式微通道冷却器研制

Microchannel Heatsink Cooling for High Power Semiconductor Diode Lasers

微通道热沉冷却大功率半导体激光器

Microchannel Heatsink of High Power Semiconductor Laser

大功率半导体激光器实用化微通道热沉

In this paper the coupling capacitance between the heatsink and the devices is calculated by FDTD method .

所以本文提出了采用FDTD法计算散热片与器件间的高频耦合电容的构想。

At full blast , this fan produces comparatively lesser noise than the reference heatsink unit .

得轰轰烈烈，这扇产生的噪音比相对较低的参考散热股。

The GPU ( graphics processing unit ) on many modern graphics cards requires a heatsink and fan .

在GPU（图形处理单元）在许多现代显卡需要一个散热片和风扇。

In this paper , there are the FDTD equations about current source and the results of radiation of heatsink using different sources .

本文给出了电流源作为激励源情况下的FDTD方程，并给出了运用FDTD法计算不同激励源下，散热片的辐射电平的计算结果。

We provide one-stop service including aluminum heatsink design & making , industrial profiles extrusion , CNC machining and further process .

提供集铝合金挤压型材散热器设计、挤压模具设计、制造、工业型材挤压生产到产品CNC深加工的一站式服务。

Refer to the documentation that came with the fan heatsink and motherboard user guide .

请参考散热器的产品说明文件和主机板使用手册。

The analysis on microchannel heatsink of high power semiconductor laser can achieve lower heat resistant and fine temperate homogeneity , thus ensure long longevity and steady work .

研制高功率半导体激光器微通道热沉可以实现非常低的热阻及良好的温度均匀性，从而保证激光器长寿命、稳定工作。

The characteristics of heatsink electromagnetic radiation are analyzed by the aspects of grounding methods , number and thickness of cooling fins changes , height of cooling fin changes .

从不同的接地方式，鳍片数目、厚度、高度变化几个方面分析了热沉的电磁辐射特性，提出了影响谐振频率的关键因素，并从电磁兼容角度提出了热沉设计的注意事项。

It is shown that in high frequency , size of the heatsink and devices is approximate to wavelength , the value of the capacitance is influenced by distributed parameters .

计算结果表明：高频端，散热片和电力电子器件的尺寸与所关心的波长相比拟，分布参数影响了该电容的数值。

The electro-thermal coupling researches on high power inverters can play an important role in the device selection and application , heatsink design , inverter structure optimization , and benefit the inverter system stability .

对大功率逆变器进行热-电耦合的研究可以为功率器件的选型与使用、散热器的合理设计、逆变器结构优化以及整个逆变系统的可靠运行提供有价值的参考。

The amplifier controls and connections are mounted on a metal mounting panel with an external convection cooled aluminium heatsink contained and protected within the speaker system overall dimensions .

该放大器控制和连接，安装在安装金属铝散热器与冷却控制和扬声器系统内保护的整体尺寸外部对流小组。

Coupling capacitance between the heatsink and the devices produces common mode emission , which is considered as a constant calculated by a equation resulting from the static field for a long time .

散热片与器件间的电容耦合是电路产生共模辐射的主要原因之一，其对研究电路的辐射发射特别重要。然而长期以来人们将该电容简化为平板电容，采用静电场推导的电容公式计算。

In order to increase the output power , reliability and stabilization , microchannel heatsink which is one of active heatsinks is used to cool high power semiconductor diode laser arrays in the paper .

为了提高激光器的输出功率、可靠性和稳定性，本论文选取有源热沉&微通道热沉来冷却大功率半导体激光器列阵。

In low frequency band , the crosstalk is independent of the direction of teeth and slots , and the surface wave on PCB is the main path that causes the disturbance to the close-by heatsink .

在低频段散热器之间的串扰与齿槽方向无关，印制线路板支撑的表面波传播是造成对临近散热器骚扰的主要途径。

And a high-frequency simulation modeling circuit is established with them . Using SABER software simulates the circuit , analysis the effects of passive circuit parasitic , the IGBT collector of heatsink parasitic capacitance parameter to common mode interference and differential interference .

使用Saber软件模拟仿真，对比分析了电路中的无源寄生参数、IGBT集电极对散热片的寄生电容等参数对差模干扰和共模干扰的影响。

Inversely , The path is cut out by a non-ground heat-sink , but the non-ground heatsink may enhance the radiated emissions , and such enhancement of the radio frequency radiation could cause the equipment to malfunction or contravene current EMC standards .

非接地散热器切断了共模传导电磁干扰的通路，但增强了散热器辐射发射，射频辐射的增强能够引起设备误操作或者违反目前的电磁兼容性标准。