FR-4

How to Improve Efficiently the Tg Value of FR-4 in the Press System

如何在压合中有效提高FR-4的Tg值

Development of new type of halogen free FR-4 copper clad laminates

新型无卤覆铜板的研制

Waste FR-4 printed circuit board recycling technology based on supercritical fluid carbon dioxide

FR-4型废旧线路板超临界CO2流体回收工艺分析

Study on Computation of Build-up Electric Field in FR-4 Circuit Board for Satellite

星用FR-4电路板内建电场分析计算研究

The Material Consume Control of FR-4 Produce Process

FR-4生产的材料消耗控制

Analysis of the Formation of Void in High Tg FR-4 Laminates

高玻璃化温度FR-4层压板气泡产生原因分析

The Study of the Formulation of Adhesive Used for FR-4 Glass Cloth Laminate

FR-4层压板用胶粘剂配方的研究

Recognition about Specification and Equilibrium of Performance in Lead Free FR-4 CCL (ⅰ)

对无铅FR-4覆铜板标准及性能均衡性的认识（上）

Study on and synthesis of epoxy resin special for FR-4 copper clad laminate

FR-4覆铜板专用环氧树脂的研究与合成

Flexible FR-4 CCL is one of the most important development director for FPC products .

所以，挠性FR-4覆铜板材料无疑是今后形成和发展FPC产品的一个重要方面。

New Synthesis Process of Brominized Epoxy Resin for FR-4 Copper Clad Panel

FR-4覆铜板专用溴化环氧树脂合成新工艺

This article brief introduces the material consume control of FR-4 produce process base on the point of reduce cost .

主要从降低成本的角度，对FR-4生产的过程控制方面简要阐述了各种材料的消耗控制。

The Improvement of Appearance Quality for FR-4

FR-4覆铜板外观质量改进与提高

Synthesis of Phosphorous Containing Resin and Application in Environmental Friendly FR-4 Copper Clad Laminate

含磷酚醛树脂的合成和在环保型FR-4覆铜板中的应用

Through the TLC and HPLC analysis , we found that Fr-4 was a highly purified compound .

通过TLC检测和HPLC分析可知，Fr-4部位是一种纯度较高的化合物。

This article mainly tells us the cause of which effects appearance improvement on FR-4 laminate and put forward some improved methods .

该文主要介绍了影响FR-4覆铜板外观质量的原因，并提出一些改进方法。

Study on modification of FR-4 with phenoxy resin

酚氧树脂在FR-4覆铜板中的应用研究

The Causes and Prevention of White Edges / Corners in FR-4 Laminate and Multilayer

FR&4覆铜板、多层板白边白角成因与消除

Development of non-halogen flame retardent FR-4 copper clad laminates

无卤化FR-4覆铜板开发进展

Applicable Foreground of Flexible FR-4 CCL

挠性FR-4覆铜板材料的应用前景

Development of FR-4 CCL in Lead-free

无铅FR-4覆铜板的开发

The law of strength change of fiberglass sheets in FR-4 printed circuit board ( PCB ) recycling with supercritical fluid CO2 is researched .

文章对超临界CO2流体回收FR-4型线路板过程中玻璃纤维布强度变化进行了研究。

It is proved that the prepared CCL using MFP cured with FD or ED can meet the requirements of FR-4 .

经过分析测试证明，用MFP固化FD和ED所制得的板材，其综合性能均能满足现今FR-4覆铜板的基本使用要求。

In this paper , the mechanics properties of FR-4 PWBs were tested with the help of omnipotent tester , air gun impact device and high speed dynamic analysis system .

本文借助万能试验机、空气动力枪及颗粒高速动态分析系统分析了FR-4型线路板的力学性质；

This paper describes the hybrid-construction PCB were fabricated by the FR-4 laminate and high performance low-loss prepreg to achieve lower signal crosstalk and permit lower cost .

综述了采用低成本的常规FR-4层压板芯材和低介电常数高性能的半固化片形成的混合结构印制板，它具有较低的信号串扰和较低的成本。

The dielectric properties of epoxy resin were improved by cyanate . we used the improved epoxy resin and developed FR-4 printed circuit board with lower ε r and tg δ .

本文采用氰酸酯改性环氧树脂体系，使之改性的环氧树脂体系介电性能提高（低εr、低tgδ）。

The pyrolysis oil is extracted from FR-4 type printed circuit boards with this method , the total obtained phenols is 62.0 % of the pyrolysis oil , and the best purity for phenol reached 96.51 % .

结果显示运用该方法对FR-4型线路板的热解油进行提取分离，得到总酚占热解油的62.0%，其中，苯酚的纯度最高可达96.51%。

When the thickness of microstrip is 18 mm and the thickness of medium is 0.25 mm , the attenuation factor of conductor of FR-4 and F_4B materials are respectively 0.049 9 dB / cm and 0.035 7 dB / cm .

当微带厚度为18μm，介质材料厚度为0.25mm时，FR4和F4B的导体衰减系数分别为0.0499dB/cm和0.0357dB/cm。