Electronic packaging materials

Current Status of Research on Electronic Packaging Materials

电子封装材料的研究现状

The New Generation of Green Electronic Packaging Materials

新一代绿色电子封装材料

Research on High Performance Novel Electronic Packaging Materials of Silicon-based Aluminum

新型硅基铝金属高性能电子封装复合材料研究

Morphology of the water in plastic electronic packaging materials

电子封装塑封材料中水的形态

Effect of Pressing Pressure on Properties of Si-Al Electronic Packaging Materials

压制压力对Si-Al电子封装材料性能的影响

Fundamental study of new Si-Al electronic packaging materials

新型电子封装Si-Al合金的基础研究

Microstructure and properties of W-Cu electronic packaging materials by plasma spraying

等离子喷涂W-Cu电子封装材料的组织与性能

Properties of Si-Al Electronic Packaging Materials Fabricated by Hot Pressing

热压法制备Si-Al电子封装材料及其性能

New Spray Formed Light Weighted Si-Al Electronic Packaging Materials with Low Thermal Expansion and High Heat Conducting

新型喷射成形轻质、高导热、低膨胀Si-Al电子封装材料

PM Process of Si-Al Electronic Packaging Materials

Si-Al电子封装材料粉末冶金制备工艺研究

Simulation of Solidification Behavior in Spray-deposited Si-Al Preforms Used for Electronic Packaging Materials

喷射成形电子封装Si-Al合金凝固过程模拟研究

Exploring new types of Lead-free solders have become one of the main contents on studying the electronic packaging materials .

开发新型无铅钎料已成为电子封装材料主要研究内容之一。

Si-50 % Al ( mass fraction ) electronic packaging materials were fabricated by liquid phase sintering .

采用粉末冶金液相烧结工艺制备了Si-50%Al（质量分数）电子封装材料。研究了压制压力、烧结工艺对材料微观组织及性能的影响。

The CPC electronic packaging materials have the best integrated properties when annealed under the temperature of 900 ℃ for 1.5 hours .

退火工艺为900℃/1.5h时，CPC电子封装材料的综合性能最好。

With the electron devices miniaturized and integrated , better heat conductivity is required for electronic packaging materials as well as excellent electrical insulation property .

随着电子元器件微型化，集成化，要求电子封装材料不仅有良好的绝缘性能，同时对其导热性能提出了更高的要求。

In terms of electronic packaging materials , low thermal expansion coefficient and good high frequency characteristics ( ie. low dielectric constant and dielectric loss ) are two important indicators .

对电子封装材料来讲，较低的热膨胀系数和良好的高频特性（即较低的介电常数和介电损耗）是两个重要的指标。

Refined , quartz and silica powders , white carbon and nano-SiO2 have been widely used for rubber reinforcement , UV shielding and electronic packaging materials .

经过细化的粉石英、硅微粉、白炭黑等微米甚至纳米级SiO2更是在橡胶补强、紫外屏蔽、电子封装材料等化工领域应用广泛。

Polypyrrole film was prepared on the surface of epoxy resin plastic electronic packaging materials by chemical polymerization method . Effect factors of micro-morphology , adhesion and conductivity of polypyrrole film were analyzed .

研究了在环氧树脂塑料封装材料表面制备导电聚吡咯（PPy）薄膜的化学聚合方法，分析了影响聚吡咯薄膜微观形貌、附着力及电导率的因素。

Diamond / copper composite material compared with traditional electronic packaging materials , which had low coefficient of thermal expansion and high thermal conductivity , besides , the coefficient of thermal expansion matches well of Si and GaAs .

金刚石/铜复合材料与传统电子封装材料相比具有低的热膨胀系数和高的热导率，同时与Si、GaAs的热膨胀系数相匹配。

In the paper , the average CTEs of SiCp / Cu composite with particle size of 10 μ m gets 8.54 × 10-6 / ℃, which can meet the usage properties of electronic packaging materials .

本文中，10μmSiCP/Cu复合材料的平均线膨胀系数（20~100℃）达到8.54×10-6/℃，满足电子封装使用性能要求；

The method of polypyrrole ( PPy ) films being synthesized on the surface of insulating epoxy molding compound ( EMC ) electronic packaging materials and the shielding effectiveness of PPy film were studied .

研究了将导电聚吡咯（PPy）薄膜制备在绝缘环氧模塑料（EMC）电子封装材料表面的方法，及导电PPy薄膜的电磁屏蔽效能。

UV curing as a kind of radiation curing technology is the rapid development of " green " new technology , widely used in photocurable coatings , photoresist , photocurable ink , electronic packaging materials , and other fields .

UV固化是辐射固化技术的一种，是快速发展的绿色新技术，广泛应用于光固化涂料、光刻胶、光固化油墨、电子封装材料等领域。

Compared with traditional electronic packaging materials , diamond / copper composites have higher thermal conductivity , lower relative density , thermal expansion coefficient matching with semiconductor materials , etc. , which has gained extensive attention as a new generation of electronic packaging materials .

金刚石/铜复合材料由于具有热导率高、密度低、热膨胀系数与半导体材料相匹配等优点，已经成为广受重视的新一代电子封装材料之一。

Recent achievements in research for electronic packaging substrate materials

电子封装基片材料研究进展

As the materials containing lead harm to the humans and the environment , the lead-free solder has become the inevitable development of the electronic packaging connected materials .

由于含铅物质对人体和环境的危害，钎料无铅化已成为电子封装连接材料发展的必然。

Development of epoxy resin / microencaplized red phosphorus electronic and electrical packaging materials

环氧树脂/微胶囊红磷电子电气封装材料的研制

With rapid development of computer , electronic packaging and new materials , the research and design of data acquisition have continuously improved . Acquisition speed , precision and the number of channel have become more and more advance .

在计算机技术、电子封装、新材料的高速发展下，数据采集仪的研发水平也在不断地提高，采集的速度、精度和通道数等都越来越先进。

Traditional epoxy packaging materials are required for higher performance with the micro electronic packaging density increasing . Composites with high thermal conductivity can be fabricated by addition of ceramic particles or fiber into polymers , and can be used as electronic packaging materials .

微电子封装密度的提高对传统环氧塑封料的导热性能提出了更高的要求，将高导热的陶瓷颗粒/纤维材料添加到聚合物塑封材料中可获得导热性能好的复合型电子封装材料。