连接层

一般来讲，连接层表示SOA的企业服务总线（EnterpriseServiceBus，ESB）体系结构构造。

In general , the connectivity layer represents the Enterprise Service Bus ( ESB ) architectural construct for SOA .

WebsphereMQ提供了连接层和应用程序的可靠集成，为SOA提供了所需的基础。

WebSphere MQ provides a foundation for SOA by providing a connectivity layer and reliable integration for applications .

Zr对（Ag-Cu-Ti）-SiCp钎焊SiC陶瓷/钛合金连接层组织结构的影响

Effects of Zr on the microstructure of ( Ag-Cu-Ti ) - SiC_p interlayer between SiC ceramic and Ti-alloy

但是，它没有一些MVC框架所应该拥有的功能，例如表单构造器和数据库连接层。

However , it does not bundle many other features of MVC frameworks such as form builders and database connection layers .

连接层定义通道、全局请求和借以提供SSH服务的通道请求。

The connection layer defines channels , global requests , and the channel requests through which SSH services are provided .

关键技术是构造了类似于数据库JDBC思想的ERP连接层的概念，使得MEAM在理论上与后台ERP系统的具体选择无关。

In the abstract , MEAM is independent of back-end ERP system because the ERP connection layer is much like JDBC model .

在PROBIT体系结构的上下文中，连接层主要突出体现了一个代理组件。

The connectivity layer mainly highlights a broker component within the context of the PROBIT architecture .

连接层中的Cu元素与连接的Ti合金相互扩散，形成Cu-Ti相界面扩散带。

The inter-diffusion between the Cu element in the interlayer and the Ti element in Ti-alloy results into the formation of interfacial Cu-Ti phase diffusion layers .

在涂层与基体的结合部位为富含SiC的过渡连接层，在涂层的外表面为SiO2的表面涂层，涂层为具有良好抗热震性能的功能梯度涂层。

The juncture between coatings and the body was rich in SiC as transition connecting film and the exterior surface of coatings contained SiO_2 , which was of functional gradient coating with well-performed thermal shock resistance .

加入的SiC颗粒、SiC陶瓷母材均与连接层中的Ti起反应，形成表面反应层Ti3SiC2及分布于Ag-Cu-Ti合金中的Ti-Si化合物，随SiC颗粒增加，反应层变薄。

The Ti in the interlayer react with SiC particles and SiC ceramics body , forming Ti_3SiC_2 reactive layers and Ti-Si compound distributing in Ag-Cu-Ti alloy . With the increase of the amount of SiC particles , the reactive layers become thin .

HMNSA结构主要包含5个层次，分别是存储应用层、存储表示层、存储连接层、存储网络层和存储物理层。

The five levels were Storage Application Layer , Storage Presentation Layer , Storage Connection Layer , Storage Network Layer and Storage Physical Layer .

通用性&提供跨整个扩展企业环境的连接层

Universality & Provides a connectivity layer spanning extended enterprise environments

然后建立由连接层、实现层和应用层组成的三层开放式结构；

Then constructs a three-layer open architecture : Connection Layer , Implementation Layer and Application Layer ;

连接层可用冲压成型的钢质菱形网，用气体保护焊接方法点焊于钢板上。

Layer can be used to connect steel stamping forming diamond-shaped network , with gas shielded welding spot on the plate .

在强碱性环境下，片层边缘连接层与层之间的氢键被削弱，使得层内存在应力。

However , under highly basic condition , the interlayer H-bond linkage at the sheet edges can be weakened , causing stresses in the layers .

它提供了很多可供较高层和较低层驱动器使用的函数，因而可以充当这两层间的连接层。

It provides a number of functions that are used by upper-and lower-level drivers and , therefore , serves as the glue between these two distinct layers .

此体系结构划分为各个抽象层，从外部环境层开始，然后是感测和执行层、连接层，以及认知层。

This architecture is divided into layers of abstraction starting with the external environment layer , the sensing and actuating layer , the connectivity layer , and the cognitive layer .

通过磷酸化学吸附和硅烷化方法在薄膜表面固定的生物分子层不稳定，主要的原因是中间连接层的硅烷化表面不断水解的原因。

Since the middle layer of silane hydrolyzes continuously , immobilized biomolecules on the Ti-O film are unstable by the method of silanization via chemisorption of H3PO4 interface . 2 .

功率的瞬间开关引起的温度波动，或者外部元器件通常经历的周围环境温度改变，结果导致由于热膨胀系数不匹配造成的焊接连接层塑性应变变形。

Temperature fluctuations caused by power transients or environmental changes commonly experienced in external applications results in thermal expansion mismatch between the various package materials causing the plastic strain deformation of the solder interconnects .

根通过提供各种图形层（例如连接层和句柄层等）以及可能会在查看器级别提供的视图缩放或其它功能，为内容打下基础。

The root lays the foundation for the contents by providing various graphical layers , such as connection layers , handle layers , etc. , and possibly zoom or other functionality at the viewer level .

过量的（Ti+C）粉末则导致反应不完全，容易在连接层中产生孔洞，影响接头强度；

However , excess amount of ( Ti + C ) powder easily brings about the formation of pores and incomplete reactions of Ti and C in the bonding layers , which are detrimental to the joints ' strengths .

研究结果表明，反应粘接可以使母材间形成良好的接合界面，连接层未对整体材料的强度和电阻率造成明显的影响。

This study showed that a good contact interlayer was formed between monolithic materials by this method , and the flexural strength and electrical resistivity of silicon / silicon carbide bulk materials were not affected significantly by the reaction-forming joints .

使用Spring连接各个层，实现高内聚，低耦合。

Using Spring to connect each layer to achieve " high cohesion , lowcoupling " .

半固态连接复层材料界面强度SP评价

Interfacial strength evaluation of semi-solid joining clad material by small punch test

在数据连接管理层中，作者研究了创建型模式中简单工厂方法模式FactoryMethod的应用环境、应用方法，利用该模式解决与异构数据库连接的问题。

In the layer of database connection , author has studied the application environment and method by factory method and utilized this pattern to solve the connection problem of different database .

NET对现有OPC服务器进行转换，通过COMInterop连接低层的OPC服务器，访问现场数据；

NET to the current OPC server converting , low layer OPC server is linked by COM Interop , the field data is interviewed .

MAC协议位于开放系统互连模型中的数据链路层，主要负责控制与连接物理层的物理介质。

The MAC protocol is a part of the Data Link Layer in the OSI seven layers . It is responsible for control and link the physical media in Physical Layer .

生产运行系统（MES）是连接现场层与管理层的生产管理技术，是一种实时信息系统，是企业实施快速制定战略、实现车间生产敏捷化的基本技术手段。

The manufacturing executive system ( MES ) is a management technology for connecting production and management teams and is also a real-time information system to formulate strategy quickly and achieve production flexibility .

重点介绍了行业标准《钢骨混凝土结构设计规程》YB9082-97中不同材料性能的柱与柱的连接过渡层以及柱脚的设计。

Design of column splice and column base of SRC structure were described .

由于同层的结点作用是一致的，结点所承担的负荷均衡，连接两层间的工作由8个UGN关口结点共同均分承担。

The load borne by every node of the same layer is balanced , for example the 8 Unconnected Gate Nodes ( UGN ) link two layers jointly and averagely .