大规模集成电路

随着IC产业的高速发展，以IP核复用技术和超深亚微米工艺为支撑的系统芯片（简称soc）技术，是当前嵌入式电子产品和超级大规模集成电路设计的主流。

With the rapid development of IC industry , System-on-chip technology which is Multiplexing of IP cores and ultra-deep sub-micron technology for the support , is the current mainstream of Embedded electronic product design and super LSI .

在大规模集成电路设计中该模型可用于模拟预测SiGe-p-MOSFET的阈值电压、电流-电压及电容-电压特性。

This model can be applied to simulate the threshold voltage , current-voltage and C-V characteristics of Si / SiGe-p-MOSFET in LSI simulation .

IP核可重用设计方法是未来大规模集成电路的主流设计方法。

Reusable design method of IP core is the main method in designing large scale integrated circuits .

随着大规模集成电路的发展，IC设计已经进入SoC时代。

With the development of VLSI , IC design paces in the SoC period .

SoC是大规模集成电路发展的必然趋势。

SoC is the trend of VLSI .

IBM公司用大规模集成电路（LSI）芯片设计了多芯片多层陶瓷组件以提高性能和密度

IBM Multichip Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and Density

随着大规模集成电路和信息技术的飞速发展，片上系统（Systemonchip，SoC）技术受到了前所未有的关注。

With the rapid development of large scale integrated circuit and information technology , the System on Chip ( SoC ) technology has caught unprecedented attention .

随着工艺的发展，片上系统（systemOnaChip，SOC）设计已经成为大规模集成电路设计中的热门领域。

With the development of technology process , System on a chip ( SOC ) design has become a hot point of very large-scale integrated circuit design .

大规模集成电路浮栅ROM器件总剂量辐射效应

Total Dose Effect of Large-Scale Integrated Circuit Floating Gate ROM Devices

射频识别（RadioFrequencyIdentification，即RFID）技术是随着大规模集成电路技术的发展与成熟而逐渐兴起的一项自动识别技术。

RFID ( Radio Frequency Identification ) is a sort of automatic identification technique which is advancing owing to the development of the large scale integrated circuit .

应用CMOS低功耗器件、大规模集成电路和硬软件相结合提高可靠性；

The reliability is improved by applying low power-consumption CMOS units , large-scale intergrated circuits and combining hardware with software .

化学机械抛光（CMP）已经被广泛的应用于大规模集成电路的制造中。

Chemical Mechanical Polishing ( CMP ) has been widely used in VLSI manufacturing .

SoC设计是以IP核复用为基础的，基于IP核模块的大规模集成电路设计是硬件实现的关键。

SoC design is based on IP reuse , and large scale integrated circuit design based on IP core is the key of hardware implementation .

MOS大规模集成电路的可靠性

Reliability of MOS LSI Circuits

大规模集成电路高温动态老化测试嵌入式图形发生系统的可编程ASIC实现

Design of Embedded Graphic Generator for High Temperature Dynamic VLSI Burn-in Test System Using Programmable ASIC Technology

充分利用现代最新发展的大规模集成电路技术和数字处理技术，将FPGA和DSP相结合，在仔细分析雷达信号特点的基础上进行了设计。

With the development of the techniques of VLSI and digital signal process , this design makes use of FPGA and DSP based on radar signal analyzing .

可用于HDTV解码器的基于ROM查找表的IDCT电路大规模集成电路实现

LSI Implementation of ROM Look-up Table Based Inverse Discrete Cosine Transform for HDTV Decoder

扫描电子显微镜（SEM）广泛地利用于半导体表面局部电位的测定，电学功能试验和大规模集成电路失效分析。

SEM is widely used to determine local potential at the surface of semiconductors , for the electrical function testing and the failure analysis of LSI .

随着大规模集成电路和超大规模集成电路技术的飞速发展，以IC制造和封装为主的微电子制造业，已成为发展迅速、影响越来越大的高科技产业。

With the fast development of LSI and VLSI , microelectronics manufacturing characterized by IC manufacture and encapsulation has become a fast-developing and influential high-tech industry .

随着电子设计自动化（EDA）的发展，IP设计已成为大规模集成电路设计的方向。

With the development of electronic design automation ( EDA ), IP design has become the futuristic trend for the designing of large-scale integrated circuits .

大规模集成电路和MEMS技术广泛而深入的研究推动传感器向单片集成的方向发展。

The extensive and deep researches of large scale integrated circuits and Micro-Electro-Mechanical ( MEMS ) technology promote the development of the monolithic integrated sensors .

大规模集成电路（LSI）技术的发展

Development of Large Scale Integration Technology

现实生活中到处存在着复杂网络，无论是Internet或者WWW，交通线路或者大型电力网络，还是大规模集成电路或者生物网络。

In real life , there is a complex network such as Internet and WWW , transit lines and large electric power network , large-scale integrated circuits and biological network .

随着无线网络和消费电子的发展，VLSI（大规模集成电路）技术的成熟以及硬件芯片处理能力的大幅提高，移动设备变得越来越普及，性能也逐渐增强。

With the rapid development of wireless networks and consumer electronics , and the development of VLSI , hand-on devices become more and more popular .

对用于甚大规模集成电路（ULSI）制造的关键平坦化工艺&铜化学机械抛光（CMP）技术进行了讨论。

The copper chemical-mechanical polishing ( CMP ) which is the key planarization technology for ULSI manufacturing was discussed .

1971年，在一块芯片上集成了上千个组件的大规模集成电路（lsi）问世。

In 1971 , large scale integration ( LSI ) was used to put thousands of gates on a chip .

X射线光刻是一种能满足下世纪初超大规模集成电路（VLSI）生产的深亚微米图形加工技术。

X ray lithography is a main candidate for printing sub 0 1 μ m features needed for very large scale integrated circuits ( VLSI ) at the beginning of the next century .

平面问题在印制电路板的设计和大规模集成电路（VLSI）的布线方面有着重要的应用，对于很多可视化问题，例如基因调控网络的可视化也有着重大的意义。

It is widely used in designing printed circuit boards , routing very-large-scale integration ( VLSI ) circuits and very important to the visibility of the Gene Regulatory Network .

60路32kb／sADPCM转换器的大规模集成电路设计

VLSI Design for 60-channel 32kb / s ADPCM Convertor

近年来由于半导体微电子技术和大规模集成电路工艺的进步，为各国液晶显示（LCD）技术的发展提供了有利条件，特别是日本在LCD技术和产品的研究与开发方面都遥遥领先。

In recent years , the quick development of semiconductor industries has brought liquid-crystal display ( LCD ) research and production a lot of facilities . Many advances have been made with LCD technologies .