solder paste

Application of Hydroxy-alkyl-amine to Lead-free Solder Paste

烷基羟基胺在无铅焊锡膏制备中的应用

Solder powder is the main component of solder paste , and the quality of paste print mostly depend on the solder powder .

焊锡粉是焊锡膏的主要成分，其质量的好坏对焊锡膏的印刷质量起着至关重要的作用。

Technology Demands and Test Methods of Performance of Solder Paste

焊膏工艺性要求及性能检测方法

The Development of Test Instrument for Solder Paste Print Performance

焊膏印刷性能测试仪器的研制

Process Improvement for High Quality of Solder Paste Printing

提高焊膏印刷质量的工艺改进

Do not use the other metal components contact solder paste .

勿使用其它金属成份接触锡膏。

Application of SPC in Quality Control of Solder Paste Printing

SPC在焊膏印刷质量控制中的应用

So study lead-free solder paste in the electronic application package is important .

因此研究无铅锡膏在电子封装中的应用具有重要意义。

Preparation and Study of No-clean Flux Used for Making Solder Paste

焊膏用免清洗助焊剂的制备与研究

Polymer Stencil for high Quality and Speed Solder Paste Printing

适合高质量高速度印刷高聚物模版

Research on precise alignment for full automatic solder paste printer

全自动视觉锡膏印刷机精密对准研究

Research on structural optimization of the frame of high-accuracy solder paste printer

高精度锡膏印刷设备的机架结构优化研究

The solder paste made with the flux has good welding performance and a long storage life .

该焊剂制备的焊膏焊接性能良好、存储寿命长。

Research of Activation Temperature of Rosin - Based Flux for Lead-Free Solder Paste

无铅焊膏用松香型助焊剂活化点的研究

Performance of Ag-Cu-Sn-In Alloy Solder Paste at Middle Temperature and Its Application

Ag-Cu-Sn-In中温焊膏的性能与初步应用试验

Familiar with lead-free solder paste and at least 3 years related sales experience .

熟悉无铅锡膏产品及市场，具备3年以上行业销售经验。

The Synthesis of the New Activator and Applied in the Lead-free Solder Paste

新型活化剂的合成及在无铅焊膏产品上的应用

Lead-Free Solder Paste Applied in Surface Mount Technology

无铅焊膏在电子封装组装中的应用

Research of a Build-in Defect Inspection Algorithm for Lead-free Solder Paste Printing

内置无铅锡膏印刷机的检测算法研究

Is the average and range of Solder Paste height measurements SPC controlled ?

锡膏厚度测量的平均值和间距SPC是否受控？

The Process Technology of Solder Paste Printing Stencil

漏印焊膏模版的自制工艺

Is the upper and lower specification limits for individual Solder Paste height measurements also defined ?

单点锡膏厚度测量是否定义了其控制上限和下限？

This paper describes the development trend of low melting point and high melting point type Lead-free solder paste .

概述了低熔点和高熔点型无铅焊膏的开发动向。

Study on the Lead-Free Solder Paste Prepared by Mechanical Alloying in SMT

电子组装膏状钎料机械合金化制备及研究

An important reason of Electronic product quality defects is the solder paste printing defects when Surface Mounted .

而引起电子产品质量缺陷的一个重要原因就是贴片安装时锡膏印刷的缺陷。

Solder paste , screen printing , use ways , printing process course will decide the printing quality .

在锡膏印刷工艺中，锡膏、丝印机、锡膏使用方法和印刷工艺过程将影响到印刷质量。

Aluminum solder paste and its application

铝钎料膏的研制及其在钎焊中的应用

Research of Evaluation on Printability of Solder Paste

焊膏可印刷性评价方法的研究

Effect of Solder Paste Volume on Reliability of CBGA Assemblies

焊膏厚度对CBGA组装板可靠性的影响

The system provide a reasonable and effective solution in optimizing solder paste inspection process and making full use of human resources .

系统在优化锡膏检测作业流程、充分利用人力资源上提供了一套合理的、有效的解决方案。