cmp

Study on CMP effluent and its treatment by an integrated process

混合材CMP废液综合治理技术的研究

Applying CMP technology improves agility and efficiency of Enterprise Management Information System .

应用CMP技术提高了企业信息化系统应用的敏捷性和高效性。

The basic principal and development of CMP are introduced .

介绍了化学机械抛光的基本工作原理和目前发展情况。

Refraction seismic interpretation method in CMP domain and its application case

共中心点域浅层折射波解释方法及应用实例

Study on Kinematic Mechanism of Rotary CMP Equipment with Single Head

单头单面旋转式化学机械抛光机的运动机理研究

Zone Back pressure Control Using for Vacuum Carriers in CMP

CMP加工中的真空吸盘区域压力控制技术

Properties of Surface Oxidation Film in CMP of Computer Hard Disk Substrate

计算机硬盘基片CMP中表面膜特性的分析研究

Based on the research results , the material removal mechanisms of copper CMP were analyzed .

根据现有的研究成果主要介绍了铜化学机械抛光的化学材料去除机理；

The corrosion of Cu CMP will impact product yield and reliability .

铜在化学机械研磨面临的铜腐蚀问题使得产品良率和可靠性都受到威胁。

Study of Computer Hard Disk Substrate and Its CMP

计算机硬盘基板及其CMP技术分析研究

Air distribution and microenvironment evaluation of CMP desktop task air conditioning

CMP桌面工位空调的气流组织与微环境评价

Research Progress of CMP Technology in Ultra-precision Surface of Single-crystal Silicon

用于超精密硅晶片表面的化学机械抛光（CMP）技术研究

Study on Treatment Technology of CMP Effluent

化学机械浆废水处理技术探讨

Study on CMP Technology of Single Crystal MgO Substrates for High Temperature Superconductors

单晶MgO高温超导基片CMP工艺的研究

Research on Pulping , Bleaching and Paper Making of Poplar CMP

杨木CMP的制浆漂白和配抄的研究

The characteristics of the processor make it suitable for the core of CMP .

上述优点使该处理器内核经过裁减非常适合作为单芯片多处理器的内核。

A Study on Mechanisms for Chemical Action of Tungsten Plug in CMP

钨插塞在化学机械抛光中的化学作用机理研究

Nowadays , CMP technology has been widely used in ULSI manufacturing .

目前，CMP技术已成为ULSI时代最广泛使用的平坦化技术。

Effect of barrier slurry properties on post CMP cleaning efficacy

阻挡层浆料特性对CMP后清洗效力的影响

Post CMP cleaning technology in the fabrication of integrated circuits

集成电路制备中化学机械全局平面化（CMP）后的表面清洗技术

Factors influencing the generation rate of oxidized layer on wafer surface in CMP

CMP过程芯片表面氧化膜生成速度影响因素的分析

Treatment of Kenaf CMP with Hot Water and Organic Solvent

红麻化机浆漂前热水处理和漂后有机溶剂洗滤

CMP has become the mainstream of the market .

CMP已经成为市场的主流，对CMP处理芯片的研究也成为了必要。

Dependency of Material Removal Rate on Velocity in CMP of Microelectronic Materials

微电子材料CMP加工中去除率与速度的关系

Study on CMP Nano - Slurry and Technology

CMP纳米抛光液及抛光工艺相关技术研究

This process goes round and round , and copper CMP was finished .

这样新鲜的铜表面在浆料的作用下继续被氧化，机械磨除、络合，反应产物被湍流的浆料带走，周而复始，完成铜的CMP过程。

Optimal Way for Ultrafiltration - Biochemical Treatment of CMP Effluent

化机浆废水超滤-生化处理途径的优化

Study on Mechanism of CMP Polishing Motion

CMP抛光运动机理研究

Technology Analysis on Copper CMP Slurry in ULSI Manufacturing

ULSI制造中铜CMP抛光液的技术分析

High combination to copper ions avoids abrasive contamination and yields high CMP rate ;

保证了强络合，解决了颗粒沾污，提高了铜CMP速率；