Reflow soldering
- 网络回流焊接;再流焊
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This paper introduces a production line which consists of manual reflow soldering tools according to the conditions of PCB design and production in our institute .
本文介绍了根据我所的PCB设计和生产情况配置的由OK公司的手工再流焊接工具组成的生产线,包括维修系统、热风焊笔、点胶机。
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New Development of Reflow Soldering Heating Equipment
再流焊接加热设备的新进展
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Software design of reflow soldering temperature measurement system based on VB
基于VB的回流焊温度测试系统软件设计
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Simplified Decoupling Control on the Reflow Soldering Machine Heat Balance Mechanism Model
基于热风回流焊机热平衡机理模型的简化解耦控制
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Automatic Management System of Solder Joint Reliability in Reflow Soldering
再流焊焊点可靠性自动管理系统
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Research status of reflow soldering technology in microelectronic packaging and assembly
微电子封装与组装中的再流焊技术研究进展
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The thermal Distortion Simulation of Lead Free PCB Assembly During Reflow Soldering Process
回流焊中常见的缺陷&锡珠无铅PCB组件再流焊焊接工艺的热变形仿真分析
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The Research of Reflow Soldering On the Kinetic Process of Soldering
锡焊动态过程的研究
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Dynamic Modeling and Simulation for Multiple Temperature Zones System of Reflow Soldering Machine Based on Heat Balance Mechanism
基于热平衡机理的热风回流焊机多温区系统动态建模及仿真
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Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering
无铅回流焊冷却速率对焊点质量的影响实施倒装芯片的组装
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Analysis of thermal stress and hygrothermal stress for SiP device in reflow soldering
SiP器件回流焊时湿热应力的分析
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Research the Compatibility of Lead Free Reflow Soldering
无铅再流焊的兼容性研究
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Study on Improving the Joint Quality of Reflow Soldering for Large Dimension Copper-Clad Laminates
提高大面积敷铜箔板再流焊接质量的研究
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Statistical Process Control of Reflow Soldering
再流焊工艺的统计过程控制
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Please follow " Reflow Soldering Conditions " in catalogue .
请遵守产品目录中的回流焊条件。
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This paper summarizes the BGA property and repairable process after hot air reflow soldering .
该文综述了BGA元器件的特性和其返修工艺。
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Mounting Membrane Combined IC with Reflow Soldering Technology
用再流焊技术组装薄膜混合集成电路
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Sn-Cu-Bi Alloy Plating Bath Tin Ball in Reflow Soldering Process Formation
锡-铜-铋合金电镀液回流焊中常见的缺陷&锡珠
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The application of reflow soldering and SMT in R & D and production
回流焊接工艺与表面贴装技术在科研生产中的应用
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In the end , PLC and temperature sensors are used to complete the reflow soldering temperature control and detection .
采用PLC和温度传感器完成对回流焊温度的现场检测和控制,达到了工艺要求。
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Design stencil according to requirement of inserter soldering quality and reflow soldering technology .
根据插件焊接质量的要求,按照回流焊工艺设计印刷模板。
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The Formation and Prevention of the Soldering Balls at Reflow Soldering
再流焊锡珠的形成与预防
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HOT BARThe hot wire is widely used in welding , solder reflow soldering .
广泛应用于线材的热压焊、焊锡焊接的回流焊,IC贴片。
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SMD lamp beads , manufactured through full automatic reflow soldering line .
贴片灯珠,全自动化回流焊生产;
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The recent work about the modeling and simulating of reflow soldering process home and abroad are introduced in the paper .
主要介绍了国内外再流焊工艺建模与仿真研究现状。
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Pin - through - hole Reflow Soldering Technology
通孔再流焊技术
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Thermal impact to PCBA during reflow soldering is considered one of the main drivers for manufacturing defects .
在再流焊过程中受到热冲击已成为PCB组件生产过程中产生缺陷的主要原因之一。
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Effect of Temperature , Moisture and Vapor Pressure on Delamination in a PBGA During Reflow Soldering Process
回流焊过程温度、潮湿和蒸汽压力对PBGA分层的影响
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What other issues can be expected with the conversion to lead-free reflow soldering ?
转变到无铅回流焊接还会遇到什么问题?
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Probe into Reflow Soldering Process
回流焊工艺探讨